Dynamic Random Access Memory DRAM Industrial F60C1A0004-M7 DDR3L X16 4Gb F60C1A0004-M79W
Device Features
Density:4G bits
Organization
256Meg x 16 bils
Package
96-balI FBGA
Lead-free (RoHS compliant) and Halogen-free
Power supply
VDD/VDDQ =1.35V(1.283 to 1.45V)
Backward compatible DDR3 (1.5V)operation
Data Rate:
1600Mbps,1866MbpS
2KB page size (x16)
Row address: A0 to A14
Column address: A0 to A9
Eightinternal banks for concurrent operationBurst lengths(BL):8 and 4 with Burst Chop(BC)
Burst type(BT)Sequential (8, 4 with BC)Interleave i8, 4 with BC)CAs Latency(cL):5,6,7,8,9,10,11,12, 1314
CAS Write Latency(CWL):5,6,7,8, 9,10Auto precharge option for each burst accessDriver strength:RZQ17,RZQ/6(RZQ=240Ω)Rofresh:auto-refresh,solf-refresh
Average refresh period
7.8us atTC ≤ +85'C
3.9us at +85°C ≤TC ≤+95°C
Operating temperature range
Tc = 0°C to +85°C(Commercial)
Tc=-40°C to +95'C/Industrial)
The high-speed data transfer is realized by
the 8bits prefetch pipelined architecture
Double data-rate architocture: two data
transfers per clock cycle
Bi-directional differential data strobe (DQSand DQS#)is transmittedireceived with datafor capturing data at the receiver
DQS is edge-aligned with data for READs;center aligned with data for WRITES
Differential clock inputs (CK and CK#)
DLL aligns DQ and DQS transitions with CKtransitions
Commands entered on each positive CKedge; data and data mask referenced to bothedges of Das
Data mask (DM) for write data
Posted CAS by programmable additivelatency for better command and data busefficiency
On-Die Termination (ODT) for better signalquality
Synchronous ODT
Dynamic ODT
Asynchronous ODTMulti-Purpose Register (MPR) for pre-definedpattern read outZQ calibration for DQ drive and ODT AccessProgrammable partial array self-refresh(PASR)
RESET pin for Power-up sequence and resetfunction
SRT (SelfRefresh Temperature) rangeNormal/Extended/ASR
Programmable output driver impedancecontrol
JEDEC compliant DDR3RH-Free (Row Hammer Free) option isavailable
| Product Catalogue | Memory > Dynamic Random Access Memory (DRAM) |
| Universal packaging | FBGA-96 |
| RoHS | Compliance |
| Installation method | Surface mount installation |
| Operating temperature | - |
| Length * Width * Height | - |
| Application grade | Industrial grade |
| Packaging method | - |
| Minimum working power supply voltage | 1.35V |
| Organization | - |
| Data bus width | - |
| Interface type | - |
| Storage capacity | 512MB |
| Maximum supply current | - |
| Maximum working power supply voltage | 1.5V |
Packaging and transportation instructions
- According to the standard export packaging.
Customers can choose from cartons, wooden cases and wooden pallets according to their own requirements.
Q&A
1. How to obtain the price?
We usually quote within 24 hours after receiving your inquiry (except weekends and holidays). If you are in urgent need of a price, please send us an email or contact us in any other way so that we can provide you with a quotation.
2. What is your delivery time?
This depends on the quantity of the order and the season in which you place the order. Usually, we can ship the goods within 7 to 15 days (for small batches), and for large batches, it takes about 30 days.
3. What are your payment terms?
Factory price, 30% deposit, 70%T/T payment before shipment.
4. What is the mode of transportation?
It can be transported by sea, air or express delivery (EMS, UPS, DHL, TNT, FEDEX, etc.). Please confirm with us before placing an order.
5. How do you help our business establish a long-term and good relationship?
We maintain good quality and competitive prices to ensure that our customers benefit.
2. We respect every customer as our friend. We do business with them sincerely and make friends with them, no matter where they come from.
Product Tags:
|
|
DDR3L X16 4Gb DRAM Chip Industrial F60C1A0004-M7 F60C1A0004-M79W Images
|
